Ultrasonic cleaning machines have the following characteristics in high-level cleaning of semiconductor wafers:

1. Able to provide efficient cleaning capabilities to completely remove contaminants on the semiconductor surface.

2. Able to achieve precise cleaning of microstructures and micro-sized semiconductor devices.

3. Easy to operate, with full PLC program control and touch screen operation interface.

4. Fully enclosed shell to ensure a good clean environment.

5. Equipped with multiple cleaning functions to ensure even cleaning.

In short, the ultrasonic cleaning machine can clean the wafer surface efficiently and accurately, improving the cleaning effect and product quality.

Tullker - Makes Cleaning Easier

Tullker Co., Ltd.—an environmentally friendly industrial cleaning solution provider that focuses on ultrasonic industrial cleaning and integrates R&D, production, marketing, and after-sales. In ultrasonic cleaning, vacuum hydrocarbon cleaning, two-fluid cleaning, spray cleaning, A large number of successful cases have been accumulated in the fields of DPF regeneration and cleaning, and are sold in 96 countries around the world.